Synthetic resin molded material and method for its production

ABSTRACT

A synthetic resin molded material characterized in that a thin film made of an oxide of at least one metal selected from the group consisting of Si, Zr, Ti, Ta, Hf, Mo, W. Nb, Sn, In, Al and Zn, is formed by a dry method on a synthetic resin substrate having hydrophobicity, and a method for its production.

TECHNICAL FIELD

The present invention relates to a synthetic resin molded material and amethod for its production.

BACKGROUND ART

Heretofore, a synthetic resin substrate having hydrophobicity hassometimes had a trouble attributable to the hydrophobicity. For example,a fluorine-containing resin film as a typical example of a syntheticresin substrate having hydrophobicity, is excellent in transparency,durability, weather resistance, antisoiling property, etc., and byvirtue of such characteristics, it has been used as a film for anagricultural or horticultural house instead of a vinyl chloride resin.However, when a fluorine-containing resin film is used for anagricultural or horticultural house, moisture condensation is likely toform on the inside surface of the film as the film has nohydrophilicity, whereby problems are likely to result such thatsunlights required for the growth of plants tend to be blocked, ordeposited water drops are likely to drop directly on crop plants insteadof flowing in the form of a water film on the film surface, to presentadverse effects.

To solve such problems, as a method for imparting hydrophilicity to thesurface of a synthetic resin substrate, a coating method has heretoforereported in which a mixture of a silica-type sol and a surfactant, iscoated on the resin surface, followed by drying to impart hydrophilicity(e.g. JP-A-62-179938, JP-A-5-59202 and JP-A-5-59203).

However, with the hydrophilic film obtained by this method, thehydrophilicity does not last for a long period of time, and in a casewhere it is used for a synthetic resin which has a long useful life likea fluorine resin film, there has been a problem that costs and time willbe required, as it is necessary to carry out recoating periodically.

The present invention is intended to solve the above-mentioned problemsof the prior art and to provide a synthetic resin molded material havingadequate hydrophilicity, whereby the hydrophilicity will last for a longperiod of time.

DISCLOSURE OF THE INVENTION

The present invention provides a synthetic resin molded materialcharacterized in that a thin film made of an oxide of at least one metalselected from the group consisting of Si, Zr, Ti, Ta, Hf, Mo, W, Nb, Sn,In, Al, Cr and Zn is formed by a dry method on a synthetic resinsubstrate having hydrophobicity.

In the present invention, it is important to form the thin film made ofan oxide of at least one metal selected from the group consisting of Si,Zr, Ti, Ta, Hf, Mo, W, Nb, Sn, In, Al, Cr and Zn by a dry method,whereby a desired synthetic resin substrate having hydrophobicity caneffectively be made hydrophilic.

The above treatment to impart hydrophilicity is to modify thehydrophobic synthetic resin surface to be hydrophilic. As a result, adrop flowing property (a property to let water drops deposited on thesurface flow), an antifogging property (a property to prevent fogging bymoisture condensation), an anti-mist property (a property to prevent amist attributable to water drops deposited on the film surface), anantistatic property (a property to prevent electrification of staticelectricity), a wettability (a nature to be readily wetted) or the likewill be improved.

The thin film of an oxide to be used in the present invention, is notparticularly limited so long as it is an oxide of at least one metalselected from the group consisting of Si, Zr, Ti, Ta, Hf, Mo, W, Nb, Sn,In, Al, Cr and Zn.

It is preferably a thin film made of an oxide of a metal containing atleast Si, since it is thereby possible to obtain high hydrophilicity.This is believed to be attributable to the fact that Si present on theoutermost surface of the thin film layer and moisture present in theatmosphere will bond to form a highly hydrophilic SiOH state.

Specific examples of the oxide of a metal containing at least Si,include oxides comprising SiO₂, oxides of Si and Zr, oxides of Si andTi, oxides of Si and Ta, oxides of Si and Nb, oxides of Si and Sn,oxides of Si and Zn, or oxides of Si, Sn and Ti, as the main components.

From the viewpoint of the initial hydrophilicity, the durability ofhydrophilicity for a long period of time and the material cost, an oxidecomprising SiO₂ as the main component is preferred.

From the viewpoint of the initial hydrophilicity, the durability ofhydrophilicity for a long period of time, the adhesion to the substrateand the productivity, oxides comprising oxides of Si and Sn, oxides ofSi and Zr, or oxides of Si and Ti, as the main components, arepreferred. Particularly preferred are oxides comprising oxides of Si andSn as the main component.

Further, with a view to providing a photocatalytic function so as toprovide an effect for decomposing or preventing deposition of a stain,by irradiation of sunlight, against deposition of a stain which isconsidered to be one of factors to prevent the long lasting effect ofhydrophilicity, oxides comprising oxides of Si and Sn, oxides of Si andTi, or oxides of Si, Sn and Ti, as the main components, are preferred.

From the viewpoint of providing various properties including theabove-mentioned drop flowing property, the thickness of the thin film ofan oxide in the present invention is preferably at least 3 nm. Further,from the viewpoint of maintenance of visible light transmittance,maintenance of flexibility of the synthetic resin substrate and adhesionto the substrate, the thickness is preferably at most 100 nm, morepreferably at most 30 nm.

In a case where the thin film of an oxide in the present inventioncontains at least Si, the proportion of Si is preferably such that Si isfrom20 to 80 atomic %, more preferably from 30 to 70 atomic %, to thetotal metals.

By adjusting the proportion of Si within the above range, it is possibleto obtain effects such that 1) by the effect of contained Si, therefractive index of the oxide film can be properly made small, and it ispossible to obtain a synthetic resin molded material having a desiredcolor, 2) by the effect of metal components other than Si, theabove-mentioned various properties including the drop flowing propertycan be obtained even when the oxide film is made thin, and 3) when adirect current sputtering method is employed as a film forming method,arching can be prevented by using an alloy target having a compositionalrange similar to that of the oxide film.

The contact angle to water of the oxide film tends to increase as thetime passes from immediately after the film formation. However, thelarger the proportion of Si (for example when Si is at least 50 atomic%), the smaller the change with time of the contact angle to water.

On the other hand, in a case where an alloy target is employed, if theproportion of Si increases, the film-forming speed tends to decrease.Accordingly, from the viewpoint of the productivity, Si is preferably atmost 70 atomic %.

In the present invention, the method for obtaining the thin film of anoxide is not particularly limited so long as it is a dry method. Withthe dry method, the film can be made uniform, and the adhesion of theformed film to the substrate is high, as compared with a wet system.Accordingly, the dry method is one of important requirements foraccomplishing the object of the present invention.

The dry method may, for example, be a vacuum vapor deposition method, asputtering method, a CVD method or an ion plating method. Particularlypreferred is a sputtering method, since it is excellent in theproductivity and is widely used on an industrial scale, and it ispossible to obtain by the method a film which is very dense and has highadhesion to the substrate, in a uniform film thickness.

The sputtering method may be a direct current sputtering method or aradio frequency sputtering method. A direct current sputtering method ispreferred, since it is thereby possible to form a film efficiently at ahigh film forming speed on a substrate having a large surface.

As an example of a film of the oxide comprising SiO₂ as the maincomponent, a thin film made of SiO₂ may be mentioned. The thin film madeof SiO₂ can be obtained by forming a film by a radio frequencysputtering method in an oxygen-containing atmosphere using a Si target.It can also be obtained by forming a film by a radio frequencysputtering method in an oxygen-free atmosphere using a SiO₂ target.Further, it can be obtained by a direct current sputtering methodwherein an intermittent negative direct current voltage is applied tothe target, instead of the radio frequency sputtering method.

The power density to the target during sputtering is usually from 1 to20 W/cm², and the gas pressure is usually from 1 to 10 mTorr, preferablyfrom 2 to 6 mTorr.

As an example of the film of oxides comprising oxides of Si and Sn asthe main components, a thin film made of oxides of Si and Sn may bementioned. The thin film made of oxides of Si and Sn can be obtained byforming a film by a reactive sputtering method in an oxygen-containingatmosphere using a target of a mixture of Si and Sn.

In a case where the target of a mixture of Si and Sn is used, it ispossible to use a usual direct current sputtering method from such areason as improvement of the electrical conductivity of the target, andthe film forming speed can be increased, as is different from theabove-mentioned Si target. Here, by adopting a method of applying anintermittent negative direct current voltage to the target, it ispossible to effectively suppress arching during the film formation, toincrease the applied power and to maintain a high film-forming speed fora long period of time. Further, the covering rate over the surface ofthe resin substrate is improved, whereby the minimum film thickness toprovide the water dropping property will decrease, which is advantageousalso from the viewpoint of the productivity and the economicalefficiency.

Similar effects can be obtained also in a case where a target comprisingSi and at least one other metal selected from the group consisting ofZr, Ti, Ta, Hf, Mo, W, Nb, In, Al, Cr and Zn, is used. Especially when atarget of a Si-Sn type metal is used, the film forming speed is high,and the productivity is excellent.

The above-mentioned target made of Si and Sn may be in the form of amixture or in the form of an alloy. For example, a target of a mixtureof Si and Sn can be obtained by molding a mixture of Si and Sn by a CIPmethod (a cold isotropic press method) or a hot press (a molding pressat a temperature immediately below the melting point of Sn).

The synthetic resin substrate having hydrophobicity to be used in thepresent invention is not particularly limited, and a thermoplasticsynthetic resin having hydrophobicity or a thermosetting synthetic resinhaving hydrophobicity can be used.

The thermoplastic synthetic resin may, for example, be afluorine-containing resin, an acrylic resin, a polycarbonate resin, apolyester resin, a polyamide resin, a vinyl chloride resin, an olefintype resin, a polyacetal resin, a polyether imide resin, a polyethersulfone resin, a polyether ketone resin, a polyphenylene sulfide resin,a polysulfone resin, a polyallylate resin, a polyethylene naphthalateresin, a polymethylpentene resin, an ABS resin, a vinyl acetate resin ora polystyrene resin.

Among these, a fluorine-containing resin, an acrylic resin, apolycarbonate resin, a polyester resin, a polyamide resin, a vinylchloride resin and an olefin type resin are preferred from the viewpointof transparency and moldability. Particularly preferred are afluorine-containing resin, an acrylic resin, a polycarbonate resin and apolyester resin.

Among them, a fluorine-containing resin is particularly preferred, sinceit is excellent in transparency, durability, weather resistance andstain-proofing property, and it undergoes no modification even duringfilm formation in an oxygen-containing atmosphere. Further, it isconsidered that since the resin itself is expensive, it deserves for adry surface treatment, the treating cost of which is relatively high.

Here, the fluorine-containing resin is meant for a thermoplastic resincontaining fluorine in the molecular structure of the resin.Specifically, it may, for example, be a tetrafluoroethylene type resin,a chlorotrifluoroethylene type resin, a vinylidene fluoride type resin,a vinyl fluoride type resin or a composite of these resins. Particularlypreferred is a tetrafluoroethylene type resin from the viewpoint ofhydrophobicity.

Specifically, the tetrafluoroethylene type resin may, for example, be atetrafluoroethylene resin (PTFE), a tetrafluoroethylene/perfluoro(alkoxyethylene) copolymer (PFA), atetrafluoroethylene/hexafluoropropylene/perfluoro (alkoxyethylene)copolymer (EPE), a tetrafluoroethylene/hexafluoropropylene copolymer(FEP) or a tetrafluoroethylene/ethylene copolymer (ETFE).

Among them, PFA, ETFE, FEP or EPE is preferred from the viewpoint ofmoldability. Particularly preferred is ETFE, since it has mechanicalstrength durable for use outdoors for a long period of time. ETFE is theone composed mainly of ethylene and tetrafluoroethylene and a smallamount of comonomer components may be copolymerized, as the caserequires.

The comonomer components are monomers copolymerizable withtetrafluoroethylene and ethylene and may, for example, be the followingcompounds.

Fluorine-containing ethylenes such as CF₂═CFCl and CF₂═CH₂;

fluorine-containing propylenes such as CF₂═CFCF₃, and CF₂═CHCF₃;

fluorine-containing alkylethylenes wherein the carbon number in thefluoroalkyl group is from 2 to 10, such as CH₂═CHC₂F₅, CH₂═CHC₄F₉,CH₂═CFC₄F₉, and CH₂═CF(CF₂) ₃H;

perfluoro (alkylvinyl ethers) such as CF₂═CFO(CF₂CFXO)_(m)R_(f) (whereinR_(f) is a C₁₋₆ perfluoroalkyl group, X is a fluorine atom or atrifluoromethyl group and m is an integer of from 1 to 5);

vinyl ethers having a group which can readily be converted to acarboxylic acid group or a sulfonic acid group, such asCF₂═CFOCF₂CF₂CF₂COOCH₃, and CF₂═CFOCF₂CF(CF₃)OCF₂CF₂SO₂F.

The molar ratio of ethylene/tetrafluoroethylene in ETFE is preferablyfrom 40/60 to 70/30, more preferably from 40/60 to 60/40. The content ofcomonomer components is preferably from 0.3 to 10 mol %, more preferablyfrom 0.3 to 5 mol %, to the total monomers.

Specifically, the chlorotrifluoroethylene type resin may, for example,be a chlorotrifluoroethylene homopolymer (CTFE) or anethylene/chlorotrifluoroethylene copolymer (ECTFE).

In the present invention, a mixed type resin containing the abovefluorine-containing resin as the main component and having otherthermoplastic resin incorporated, may also be preferably employed.

The thermosetting synthetic resin may, for example, be a melamine resin,a phenol resin, a urea resin, a furan resin, an alkyd resin, anunsaturated polyester resin, a diallylphthalate resin, an epoxy resin, asilicon resin, a polyurethane resin, a polyimide resin or apolyparabanic acid resin.

The form of the synthetic resin substrate to be used in the presentinvention, is not particularly limited. A substrate of a film form, asheet form or a plate form is preferred.

The thickness of the synthetic resin substrate having hydrophobicity tobe used in the present invention is preferably thin from the viewpointof visible light transmittance. On the other hand, it is preferablythick from the viewpoint of the strength. Accordingly, the thickness ispreferably from 10 to 300 μm, more preferably from 30 to 200 μm.

The synthetic resin molded material of the present invention hasexcellent hydrophilicity imparted as the specific oxide thin film isformed by a dry method, and has good adhesion to the substrate, wherebythe affinity to various adhesives will be improved, and when laminatedon other synthetic resin or metal by means of such an adhesive, alaminate having a strong bonding force can be obtained.

Or, it is possible to coat on the synthetic resin molded material of thepresent invention various treating agents which used to be hardly coateddirectly on synthetic resin substrates. Accordingly, various functionalfilms can be formed, and it is possible to obtain synthetic resin moldedmaterials having various functions and excellent adhesion durability.Such various functions include, for example, a drop flowing property, anultraviolet ray insulating property, an antistatic property and anantibacterial property.

Further, with various catalytic functions represented by thephotocatalytic function, it is possible to impart an anti-soilingproperty or an antibacterial property.

The synthetic resin molded material of the present invention may beused, for example, for windows for show casings, meters, vehicles,houses or buildings, blinds, wall papers, bath tubs, interior walls ofbath rooms, interior walls of kitchens or ceiling of gas ovens, or forpackaging materials, goggles, lenses for eye glasses, mirrors, curvemirrors or parabola antennas. It is particularly useful for applicationto covering materials for agricultural and horticultural houses(film-covering type houses or hard plate covering type houses).

BEST MODE FOR CARRYING OUT THE INVENTION EXAMPLES Example 1

As a synthetic resin substrate, an ETFE film (thickness: 60 μm) wasprepared. In a sputtering apparatus, a substrate having the above filmof 10×10 cm fixed on a glass plate of 10×10 cm, was set on an anodeside, and a target made of a mixture of Si and Sn (atomic ratio of50:50) (hereinafter referred to as target A) was set on a cathode side.

The interior of the apparatus was evacuated to about 10⁻⁶ Torr , andthen argon and oxygen were introduced into the apparatus at a flow rateratio of 1:4 to adjust the sputtering gas pressure to 5×10⁻³ Torr.

Using a direct current power source, sputtering was carried out at apower density of 2.75 W/cm² to form a thin film (film thickness: about30 nm) of oxides of Si and Sn on the film surface, to obtain a syntheticresin molded material.

To examine the degree of hydrophilicity of the surface layer of theobtained synthetic resin resin molded material, the contact angle of thefilm surface to water (hereinafter referred to simply as a contactangle) was measured, and the result (the initial contact angle) is shownin Table 1.

Further, to measure the film-forming speed, film forming was carried outunder the same condition as the above film forming condition except thatonly glass was set on the anode side and the power density was changedto 5.5 W/cm². The measured film forming speed of the thin film of anoxide, is shown in Table 1.

Further, formation of thin films of oxides were carried out in variousfilm thicknesses to examine the minimum film thickness at which thecontact angle to water of the film thickness of 30 nm could bemaintained. The results are shown in Table 1.

Example 2

The operation was carried out in the same manner as in Example 1 exceptthat the direct current power source in Example 1 was changed to a radiofrequency power source. With respect to the obtained synthetic resinmolded material, various measurements were carried out in the samemanner as in Example 1, and the results are shown in Table 1.

Example 3

The operation was carried out in the same manner as in Example 2 exceptthat the target in Example 2 was changed to a Si target (hereinafterreferred to as target B). With respect to the obtained synthetic resinmolded material, various measurements were carried out in the samemanner as in Example 1, and the results are shown in Table 1.

Example 4

The operation was carried out in the same manner as in Example 1 exceptthat the target in Example 1 was changed to a target made of a mixtureof Si and Sn (atomic ratio of 65:35) (hereinafter referred to as targetC). With respect to the obtained synthetic resin molded material,various measurements were carried out in the same manner as in Example1, and the results are shown in Table 1.

Example 5

The operation was carried out in the same manner as in Example 1 exceptthat the target in Example 1 was changed to a target made of a mixtureof Si and Ti (atomic ratio of 50:50) (hereinafter referred to as targetD). With respect to the obtained synthetic resin molded material,various measurements were carried out in the same manner as in Example1, and the results are shown in Table 1.

Example 6

The operation was carried out in the same manner as in Example 1 exceptthat the target in Example 1 was changed to a target made of a mixtureof Si, Sn and Ti (atomic ratio of 50:35:15) (hereinafter referred to astarget E). With respect to the obtained synthetic resin molded material,various measurements were carried out in the same manner as in Example1, and the results are shown in Table 1.

As shown in Table 1, the initial contact angles of Examples 1 to 6 areequal, whereby it was confirmed that all of them have equalhydrophilicity. As compared with the case where target B of Example 3was used, the film forming speed was 5 times in a case where filmformation was carried out by a direct current sputtering method usingtarget A of Example 1, and twice in a case where film forming wascarried out by a radio frequency sputtering method using target A ofExample 2.

Example 7

The following experiment was carried out to examine the durability ofhydrophilicity of the surface layer of the synthetic resin moldedmaterial having the oxide thin film layer of the present invention, i.e.to examine the drop flowing property, the durability of the film, theadhesion and the weather resistance.

In Example 7, the operation was carried out in the same manner as inExample 1 except that using target A, after evacuating the interior ofthe sputtering apparatus to 3×10⁻⁵ Torr, argon and oxygen wereintroduced into the apparatus at a flow rate ratio of 1:4 to adjust thesputtering gas pressure to 2.4×10³¹ ³ Torr, and film formation wascarried out at a power density of 2.2 W/cm² to form a thin film (filmthickness: about 6 nm) of oxides of Si and Sn, to obtain a syntheticresin molded material.

With respect to the obtained synthetic resin molded material, a test forthe durability of hydrophilicity was carried out. The test apparatus wassuch that the opening of a constant temperature water tank of 80° C. wasclosed with the resin molded material so that the oxide thin film sideof the resin molded material was located on the water tank side, and theexterior temperature was controlled to be 23° C. In this apparatus, theoxide thin film was exposed to saturated steam at 80° C., and the timeuntil the hydrophilicity was lost and the moisture condensation wasformed, was examined.

Further, to examine the adhesion durability between the oxide thin filmand the substrate, a wiping test was carried out. In the wiping test,the thin film surface was wiped with a gauze, and the number of wipingoperations until the hydrophilicity was lost, and the moisturecondensation was formed on the thin film surface, was measured, and thefilm condition was observed.

Further, to examine the heat resistance of the synthetic resin moldedmaterial, a heat cycle test was carried out. The conditions were suchthat one cycle consisted of two hours at 80° C., then one hour at 20°C., then two hours at −30° C. and then one hour at 20° C., and theevaluation was carried out by the number of cycles until thehydrophilicity of the oxide thin film surface was lost.

Further, to examine the weather resistance of the oxide thin film,ultraviolet radiation for 500 hours and outdoor exposure test for twoyears were carried out, whereupon the presence or absence ofhydrophilicity was examined.

The results of the foregoing tests are shown in Table 2.

Example 8

The measurement and examination were carried out in the same manner asin Example 7 using, instead of the oxide thin film in Example 7, asilica thin film formed by coating an ethanol dispersion (solid contentconcentration=15 wt %) of a mixture comprising colloidal silica (OSCAL,manufactured by Shokubai Kasei Kogyo K. K.),β-(3,4-epoxycyclohexyl)ethyltrimethyoxysilane and polyoxyethylene-laurylether (solid content weight ratio=80:10:10). The results are shown inTable 2.

As shown in Table 2, Example 8 as a comparative example was inferior toExample 7 in the durability of hydrophilicity, the adhesion durabilityand the weather resistance. TABLE 1 Exam- Exam- Exam- Exam- Exam- Exam-ple 1 ple 2 ple 3 ple 4 ple 5 ple 6 Initial contact ≦4 ≦4 ≦4 ≦4 ≦4 ≦4angle (°) Film forming 120 50 25 100 30 85 speed (nm/min) Hydrophilicity3 3 16 5 8 6 Minimum film thickness (nm)

TABLE 2 Example 7 Example 8 Durability of Excellent hydrophilicity wasHydrophilicity was hydrophilicity maintained even after expiration lostin 10 days. of 12 months. Adhesion Excellent hydrophilicity wasHydrophilicity was durability maintained even after 100 times. lost in 3times. Heat Excellent hydrophilicity was Hydrophilicity was resistancemaintained even after at least lost after 10 cycles. 100 cycles. WeatherExcellent hydrophilicity was Hydrophilicity was resistance maintainedeven after lost by irradiation with irradiation with ultravioletultraviolet rays, and a rays or outdoor exposure. decrease in thehydrophilicity was observed by outdoor exposure.

Examples 9 to 11

Evaluation was carried out in the same manner as Example 7 except thatthe target in Example 7 was changed to C, D or E, whereby the sameresults as in Example 7 in Table 2 was obtained.

INDUSTRIAL APPLICABILITY

The synthetic resin molded material of the present invention hassufficient hydrophilicity, and the hydrophilicity lasts for a longperiod of time, and at the same time, it is excellent in theproductivity. Further, it is excellent in the adhesion durabilitybetween the film and the substrate and also excellent in the weatherresistance, whereby it is useful for applications where durability isrequired.

Further, the synthetic resin molded material of the present invention iscapable of effectively preventing moisture condensation. Accordingly,when it is used, for example, for an agricultural vinyl house, it ispossible to prevent such a drawback that incidence of sunlight isprevented by moisture condensation, or water drops deposited on theresin surface will drop on crop plants without flowing along the resinsurface.

Further, the synthetic resin molded material of the present inventionhas excellent hydrophilicity imparted, whereby affinity to variousadhesives will be improved, and the adhesion to a substrate will beexcellent. Accordingly, it makes bonding to a substrate such as a resinhaving hydrophobicity, which used to be difficult to bond, possible, andit is thereby possible to provide a laminate having a strong adhesiveforce.

And, as compared with conventional coating film, desired functions canbe attained with a film thickness smaller by at least one figure,whereby the required functions can be imparted without impairingtransparency or flexibility of the resin itself.

1-10. (Canceled). 11: A synthetic resin molded material comprising athin film made of a mixture comprising a Si oxide and a Sn oxide, andformed by a dry method on a synthetic resin substrate havinghydrophobicity. 12: The synthetic resin molded material according toclaim 11, wherein said thin film has a thickness of up to 100 nm. 13:The synthetic resin molded material according to claim 11, wherein saidthin film has a thickness of from 3 to 30 nm. 14: The synthetic resinmolded material according to claim 11, wherein said synthetic resinsubstrate is a tetrafluoroethylene type resin. 15: The synthetic resinmolded material according to claim 14, wherein said tetrafluoroethylenetype resin is a tetrafluoroethylene/ethylene copolymer. 16: Thesynthetic resin molded material according to claim 13, wherein thetetrafluoroethylene/ethylene copolymer comprisestetrafluoroethylene/ethylene in a molar ratio of 40/60 to 70/30, andoptionally comprises additionally from 0.3 to 10 mol % of comonomercomponents other than tetrafluoroethylene and ethylene. 17: Thesynthetic resin molded material according to claim 11, wherein the Sicontent is from 50 to 80 atomic % of the total of Si and Sn. 18: Thesynthetic resin molded material according to claim 17, wherein thesilica content is from 50 to 70 atomic % of the total of Si and Sn. 19:The synthetic resin molded material according to claim 11, wherein saidoxide of Si comprises SiO₂. 20: The synthetic resin molded materialaccording to claim 11, wherein said thin film additionally comprises anoxide of Ti as the main components. 21: The synthetic resin moldedmaterial according to claim 11, wherein said dry method is a sputteringmethod. 22: The synthetic resin molded material according to claim 21,wherein said sputtering method comprises reactive sputtering in anoxygen-containing atmosphere using a target comprising a mixture of Siand Sn. 23: The synthetic resin molded material according to claim 22,wherein the target comprises Si:Sn in an atomic ratio of 65:35. 24: Thesynthetic resin molded material according to claim 22, wherein thetarget comprises Si:Sn in an atomic ratio of 50:50. 25: The syntheticresin molded material according to claim 11, wherein the substrate has athickness of from 10 to 300 μm. 26: The synthetic resin molded materialaccording to claim 25, wherein the substrate has a thickness of from 30to 200 μm. 27: The synthetic resin molded material according to claim11, which has an initial contact angle of ≦4°. 28: The synthetic resinmolded material according to claim 11, which has been coated with afunctional film thereon. 29: The synthetic resin molded materialaccording to claim 11, wherein the functional film imparts at least oneproperty selected from the group consisting of drop flowing, ultravioletray insulating, antistatic, antibacterial and anti-soiling. 30: Anagricultural or horticultural house comprising a covering material madefrom the synthetic resin molded material according to claim 11.